Tensilica adds FLAC Decoder to HiFi Audio Codec Library
2010-06-30 08:04:00
Embedded Systems
Chiplet News Archive - Page 1115 of 1939
EVE Achieves Record Bookings of $19.9 Million in Q4 FY2010
2010-06-30 08:01:00
Business
LSI and Seagate Co-develop Technology for Next-Generation High-Capacity Hard Disk Drives
2010-06-30 05:38:00
Chip
Lattice and Affarii Technologies Offer Complete Remote Radio Head Hardware Solution for Wireless Infrastructure
2010-06-29 14:43:00
FPGA
Development of Close Proximity Wireless Technology with Integrated On-Chip Antenna
2010-06-29 14:26:00
IP
Global Unichip selects TranSwitch for Next-Generation HDMI supporting full-rate 3-D High Definition Television
2010-06-29 07:22:00
Deals
GE Lighting and Rambus Sign License Agreement to Create LED Lighting Solutions for Global Markets
2010-06-29 07:22:00
Business
Texas Instruments delivers industry's first discrete SuperSpeed USB 3.0 transceiver, offering more than 10 times the speed of USB 2.0
2010-06-28 18:17:00
Chip
PLX Sampling Industry's Highest-Performance USB SuperSpeed 3.0 Controllers
2010-06-28 18:14:00
Chip
L&T Infotech to collaborate with BWCI on LTE Radio Access Test Bed development
2010-06-28 14:43:00
Embedded Systems
SMSC's High Speed Inter-Chip (HSIC) USB4640 Available
2010-06-28 13:27:00
IP
WiSpry and IBM Collaborate to Develop Next-Generation of Tunable Mobile Terminal Front-End Technology
2010-06-28 12:57:00
Chip
"Lattice Diamond" FPGA Design Software Heralds New Era for Low Power, Cost Sensitive FPGA Applications
2010-06-28 12:52:00
FPGA
Dolphin Integration introduces a new Panoply of Silicon IPs for reducing the 65 nm silicon area up to 10%
2010-06-25 14:51:00
IP
nSys Announces Functional Coverage Test Suites for Upcoming PCI Express 3.0 Specification
2010-06-24 12:57:00
Verification IP
Mentor Graphics Adopts Shareholder Rights Plan
2010-06-24 09:22:00
Business
Elliptic Technologies Upgrades DRM Solution to Latest DTCP-IP Standard
2010-06-24 07:15:00
Other
IEEE Launches Next Generation of High-Rate Ethernet with New IEEE 802.3ba Standard
2010-06-24 07:00:00
Other
IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics
2010-06-24 06:36:00
Foundries
InterDigital Expands Inventec Appliances Corporation Patent License Agreement to Include Inventec Appliances (Jiangning) Corporation
2010-06-23 16:15:00
Deals