Arteris Supporting Deployment of ARM's AMBA 4 ACETM Specification
2011-06-09 16:35:00
EDA & Design Tools
Semiconductor IP News Archive - Page 1039 of 1947
Arteris Joins TSMC Reference Flow 12.0 With Flexnoc Network-on-Chip (NoC) Interconnect IP
2011-06-09 16:32:00
EDA & Design Tools
ICube Technology Unveils Its Groundbreaking Harmony Unified Processor Technology
2011-06-09 16:22:00
SoC Architecture & Assembly
Intilop corporation announces a ‘Game Changing’ record breaking Ultra low latency & highest bandwidth 10G bit TCP offload engine SOC for Xilinx and Altera FPGA families
2011-06-09 15:30:00
IP Cores & Design
Radically scalable CRISP General Stream Processor solves pitfalls of many-core
2011-06-09 14:56:00
IP Cores & Design
Cosmic Circuits is attending TSMC Symposium in Israel on 27th June 2011
2011-06-09 14:51:00
Misc
ARM and Panasonic Corporation Partner to Drive Development of UniPhier SoCs for Internet Connected Digital TV Applications
2011-06-08 15:14:00
Strategic Partnerships
Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012
2011-06-08 14:17:00
Misc
Alvand Collaborates with GLOBALFOUNDRIES to Provide Analog Mixed-Signal IP for Wireless MIMO Applications
2011-06-08 13:28:00
IP Cores & Design
EDA earns mixed grades in latest report card
2011-06-08 09:28:00
Analysis & Insight
ARM to play in games consoles, says analyst
2011-06-08 09:11:00
Analysis & Insight
Cavendish Kinetics adds Qualcomm as investor
2011-06-08 08:57:00
Strategic Partnerships
OCP-IP Delivers Memory Model Package
2011-06-08 07:27:00
EDA & Design Tools
Accent Announces Availability of Advanced Metrology Solution for Smart Grid Market
2011-06-08 01:00:00
SoC Architecture & Assembly
Triad Semiconductor secures $6M funding from new investor Development 72, LLC
2011-06-07 22:57:00
Strategic Partnerships
Kaben Wireless Announces Programmable JAT
2011-06-07 22:33:00
IP Cores & Design
ALLEGRO DVT now targets Wireless Display (WiDi) with its ultra-low latency H.264 IP cores.
2011-06-07 22:29:00
IP Cores & Design
CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
2011-06-07 22:23:00
EDA & Design Tools
Open-Silicon and Micron Align to Deliver Next-Generation Memory Technology
2011-06-07 14:48:00
Strategic Partnerships
Sonics Announces Innovative Design Environment for Accelerating Network-on-Chip Configuration
2011-06-07 09:00:00
IP Cores & Design