Xylon Announces new Memory Controller IP core
2011-06-01 13:11:00
IP Cores & Design
Semiconductor IP News Archive - Page 1042 of 1947
POSEDGE announces Multi-Port Gigabit Ethernet Switch IP with IEEE 1588 &Audio/visual (AV) bridging Support
2011-06-01 11:02:00
IP Cores & Design
TowerJazz Announces Availability of Wireless Antenna Switch SOI Process Technology
2011-05-31 15:46:00
SoC Architecture & Assembly
Elpida, PTI, and UMC Partner on 3D IC Integration Development For Advanced Technologies Including 28nm
2011-05-31 15:39:00
Foundries & Process Nodes
Silicon Image Unveils Third-Generation WirelessHD 60GHz Chipsets
2011-05-31 15:35:00
SoC Architecture & Assembly
MIPS Technologies Advances "Apps on MIPS" Development
2011-05-31 15:23:00
SoC Architecture & Assembly
DSP Group Releases Groundbreaking XpandR III Wireless Multimedia Chip
2011-05-31 15:18:00
SoC Architecture & Assembly
Mentor Graphics Forges TLM Synthesis Link Between Hardware Implementation and Virtual Prototyping
2011-05-31 15:07:00
EDA & Design Tools
India starts hunt for fab-building chipmakers
2011-05-31 15:04:00
Analysis & Insight
Nimbic Launches Scalable and Secure Cloud Computing Solution for Electronic Design Automation
2011-05-31 15:01:00
EDA & Design Tools
EnSilica and Evatronix collaborate on USB connectivity for eSi-RISC processors
2011-05-31 13:25:00
IP Cores & Design
TowerJazz Announces New Design Center Partnership Incentive Program
2011-05-31 13:05:00
Foundries & Process Nodes
Duolog and ARM Provide Accelerated IP Integration
2011-05-31 11:15:00
EDA & Design Tools
MIPS Technologies and Ingenic Semiconductor Collaborate to Bring Android 'Honeycomb' to New 1GHz MIPS-Based™ Mobile SoC
2011-05-31 10:25:00
SoC Architecture & Assembly
Cryptography Research Announces License Agreement with Broadcom for Differential Power Analysis Countermeasures Patents
2011-05-31 07:30:00
Commercial Deals
MIPS Technologies and SiS Continue to Drive Android into the Digital Home
2011-05-31 02:27:00
SoC Architecture & Assembly
Lattice Semiconductor and Digi-Key Sign Global Distribution Agreement
2011-05-31 01:57:00
SoC Architecture & Assembly
MIPS Technologies and Actions Semiconductor Collaborate to Bring Android 'Honeycomb' to New 1.3GHz Chipset for Tablets
2011-05-31 01:28:00
SoC Architecture & Assembly
eSilicon Adds China Region to its TSMC VCA Partnership
2011-05-30 13:16:00
Strategic Partnerships
Linaro partners with Samsung ecosystem to deliver exciting new low cost board 'Origen' to Open Source developers
2011-05-30 08:26:00
SoC Architecture & Assembly