450-mm brings confusion to supply chain
Mark LaPedus, EETimes
2/1/2011 8:38 PM EST
Capital spending is on the rise in 2011, but leading-edge fab capacity is expected to be tight for the foreseeable future for various reasons. Fab companies are reluctant to build new 300-mm plants and are only upgrading their existing facilities. And at least three fab companies-Intel, Samsung and TSMC-have suddenly become pre-occupied with 450-mm activity.
It’s unclear if fab companies will continue to build new 300-mm greenfield fabs in the future. Perhaps they will bypass 300-mm and simply take a quantum leap into the 450-mm era.
To read the full article, click here
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- Design And Reuse Launches at DATE2002 IP Supply Chain: a powerful environment for Intranet IP based SoC Design
- Interview: Roelandts, president and CEO of Xilinx discusses the shifting balance between FPGAs and ASICs, the role of FPGAs in consumer electronics and supply chain gains
- Celoxica and EBV Elektronik Combine ESL Design with Semiconductor Supply Chain Integration
- Standards Support Pushes VaST's CoMET6 Deeper Into Embedded Supply Chain
Latest News
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem