The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
- TSMC
- 6nm
- N6
Synopsys is a leading provider of high-quality, silicon-proven semiconductor IP solutions for SoC designs. The broad Synopsys IP portfolio includes logic libraries, embedded memories, analog IP, wired and wireless interface IP, security IP, embedded processors and subsystems. To accelerate IP integration, software development, and silicon bring-up, Synopsys’ IP Accelerated initiative provides architecture design expertise, pre-verified and customizable IP subsystems, hardening, and signal/power integrity analysis. Synopsys' extensive investment in IP quality, comprehensive technical support and robust IP development methodology enables designers to reduce integration risk and accelerate time-to-market.
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N4P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in Intel 18A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 7FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 6FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 5FF12
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
HBM3 V2 Solution enabling access to HBM3 Controller and HBM3 PHY in TSMC N3E
The HBM3 Controller IP is optimized for power, latency, bandwidth, and area, supporting the JEDEC HBM3 standard.