Vendor: T2M GmbH Category: Bluetooth

Ultra low power BLE 5.0 / ZigBee / Thread SoC - custom Modification, White Label chips

The Silicon BLE5.1/15.4 chip with internal Flash and audio support combines the features and functions needed for all 2.4GHz IoT …

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Overview

The Silicon BLE5.1/15.4 chip with internal Flash and audio support combines the features and functions needed for all 2.4GHz IoT standards. It supports standards and industrial alliance specifications including BLE 5.0 with up to 8 antenna indoor positioning support, BLE Mesh, Zigbee, RF4CE, HomeKit, 6LoWPAN, Thread, ANT and 2.4GHz proprietary standard. For some use cases, the 8258 supports concurrent multi-standards.
The chip integrates strong 32-bit MCU, BLE/802.15.4/2.4GHz Radio, 64kB SRAM, 512kB Flash, 14bit ADC with PGA, Analog and Digital Microphone input, stereo audio output, 6-channel PWM, one quadrature decoder (QDEC), flexible IO interfaces, and other peripheral blocks required for IoT (Internet of Things) applications. The 8258 also includes multi-stage power management design allowing ultra-low power operation and making it the ideal candidate for wearable and power-constraint applications.

This is available as the white label chip or any custom modification as per your requirement.

Key features

  • 32bit proprietary MCU: Better power performance then ARM M0 with max speed of 48Mhz
  • Memory: Program memory: 512kB Flash, 64kB on-chip SRAM with up to 32kB retention
  • RF transceiver: BLE 5.1 Compliant, 1Mbps, 2Mbps, Long Range 125kbps and 500kbps Or 2.4GHz proprietary 1Mbps/2Mbps/250kbps/500kbps mode with Adaptive
  • Frequency Hopping feature or 15.4 compliant, 250kbps
  • Support full-function BLE location features, angled based positioning with up to 8x antennas
  • Rx Sensitivity: -97dBm@BLE 1Mbps, -100dBm@ IEEE802.15.4 250kbps, -94dBm @ BLE 2Mbps mode, Tx output power: up to +10dBm
  • Power management: Power supply of 1.8V~3.6V with Battery monitor for low battery voltage detection and Brownout detection/shutoff and Power-On-Reset
  • Power performance : Transceiver RX mode: 6.7mA without DCDC, 3.68mA with DCDC
  • Transceiver TX mode (with modem): 6.5mA @ 0dBm without DCDC, 3.57mA with DCDC
  • Deepsleep with SRAM retention ~1uA
  • Digital and analog interfaces: Up to 32/17/10 GPIOs depending on package optionDMIC (Digital Mic), Dual AMIC (Analog Mic), I2S, Stereo Audio output SPI, I2C, USB, Swire, UART with hardware flow control and 7816 protocol support
  • Up to 6 channels of differential PWM
  • IR transmitter with DMA
  • One quadrature decoder, two-phase input selectable from 8 pins
  • 10-channel (only GPIO input), 14-bit ADC
  • 4-channel PGA, differential input Low power comparator
  • Hardware OTA upgrade and multiple boot switch, allowing convenient product feature roll outs and upgrades
  • Operating temperature: -40°C~+85°C (ET versions) or -40°C~ +125°C (AT versions)

Benefits

  • Mass production proven
  • Available as White label chip
  • Any customisation - as design service to meet your customer spec

Applications

  • • Smartphone and tablet accessories
  • • RF Remote Control
  • • Sports and fitness tracking
  • • Wearable devices
  • • Wireless toys
  • • Smart Lighting, Smart Home devices
  • • Building Automation
  • • Smart Grid
  • • Intelligent Logistics/Transportation/City
  • • Consumer Electronics
  • • Industrial Control
  • • Health Care

What’s Included?

  • Development tools include
  • EVB / EVK for testing including reference design and SDK for customers to perform evaluation, quick application prototyping and firmware development
  • Certification support
  • User documents

Specifications

Identity

Part Number
T2M8258
Vendor
T2M GmbH
Type
Silicon IP

Provider

T2M GmbH
HQ: Germany
Contact T2M GmbH

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Frequently asked questions about Bluetooth IP cores

What is Ultra low power BLE 5.0 / ZigBee / Thread SoC - custom Modification, White Label chips?

Ultra low power BLE 5.0 / ZigBee / Thread SoC - custom Modification, White Label chips is a Bluetooth IP core from T2M GmbH listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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