Vendor: VeriSilicon Microelectronics (Shanghai) Co., Ltd. Category: Bluetooth

Bluetooth Low Energy (BLE) IP

The Bluetooth Low Energy (BLE) technology supports the BLE standard defined by the International Standards Organization SIG, incl…

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GlobalFoundries 22nm FDX Silicon Proven View all specifications

Overview

The Bluetooth Low Energy (BLE) technology supports the BLE standard defined by the International Standards Organization SIG, including BLE RF transceiver IP, baseband IP, and protocol software. The BLE RF transceiver IP has been successfully verified on 55nm CMOS and 22nm FD-SOI processes, supporting data transmission and reception of 1M or 2M bandwidth in the 2.4GHz band; Baseband IP includes digital modulation and demodulation, encryption & decryption, protocol packet transceiving & verification, and various low power modes, supporting full BLE baseband functions; The protocol software includes L2CAP, GATT/ATT, SMP/GAP, etc., which allows various application requirements.

Key features

  • BLE RF IP
    • Process technology: GLOBALFOUNDRIES22FDX or SMIC55LL
    • No other special mask layers or devices such as MIM, HRP, or ESD are required
    • Compliant with the Bluetooth 5.4 Low Energy Single Mode RF Standard
    • Supply voltage: 1.1V +/-10%
    • Operating junction temperature: -40°C to 85°C
    • RF output power: up to +10dBm
    • RX sensitivity: <-96 dBm typical
    • Power consumption: TX 8mW@0dBm output, RX 6.5mW
    • Built-in on-chip Balun to save BOM
    • 16M/32M XO integrated
    • SPI-slave interface for register control
  • BLE BB IP 
    • Complete modem supporting LE 1M/2M and Coded PHY S2/S8 modes
    • Integrate DFE for RF signal pre-processing
    • Support BLE5.1 CTE signal processing
    • LE packet processing in real-time
    • RF auto-control logic integrated with SPI port
    •  
    • Work at 16MHz clock
    • Standard HCI interface based on UART port
    • Certified with SIG BQB LL5.3 full cases
    • Support AHB slave-port for SoC integration

Block Diagram

BLE IP block diagram

What’s Included?

  • Design Kit & Tape-out Kit
  • IP Datasheet and Application

Silicon Options

Foundry Node Process Maturity
GlobalFoundries 22nm FDX Silicon Proven

Specifications

Identity

Part Number
BLE IP
Vendor
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
Type
Silicon IP

Files

Product Sheet Download

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Provider

Contact VeriSilicon Microelectronics (Shanghai) Co., Ltd.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is Bluetooth Low Energy (BLE) IP?

Bluetooth Low Energy (BLE) IP is a Bluetooth IP core from VeriSilicon Microelectronics (Shanghai) Co., Ltd. listed on Semi IP Hub. It is listed with support for globalfoundries Silicon Proven.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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