High-Speed Transimpedance Amplifier
Up to 100 Gbps NRZ on GF Fotonix™, silicon-proven, GDS ready.
Overview
StarIC's high-speed TIA bridges photonic receivers to CMOS electronics on the GF Fotonix™ monolithic platform. As a GlobalFoundries Value Added Partner, StarIC delivers silicon-proven photonic-electronic interface IP that forms a foundational building block for optical interconnect ecosystems.
Process: GF Fotonix™ (45SPCLO)
Key features
- Up to 100 Gbps data rate
- NRZ option available
- GlobalFoundries Fotonix™ process (45SPCLO)
- GDS ready
Applications
- Silicon photonic receivers
- Data-center optical links
- Electro-photonic transceivers
What’s Included?
- GDS layout database
- Liberty timing models (.lib)
- LEF layout exchange format
- Documentation available
- Integration support package
- Schematics available
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| GlobalFoundries | 40nm | LP | Pre-Silicon |
Specifications
Identity
Files
Note: some files may require an NDA depending on provider policy.
Provider
Learn more about TIA IP core
Inova Semiconductors and StarIC Announce Initial Silicon Validation, Accelerating APXpress Ecosystem for Physical AI
StarIC opens design center in The Netherlands
StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem
StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe
Frequently asked questions about TIA IP cores
What is High-Speed Transimpedance Amplifier?
High-Speed Transimpedance Amplifier is a TIA IP core from StarIC Inc listed on Semi IP Hub. It is listed with support for globalfoundries Pre-Silicon.
How should engineers evaluate this TIA?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this TIA IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.