Thermal Diode on TSMC CLN4P
The thermal diode macro is implemented using high current 1.2V-oxide bounded diodes.
Overview
The thermal diode macro is implemented using high current 1.2V-oxide bounded diodes. The thermal diode is a core situated macro, which may be used with on or off chip current sources and voltage measurements to determine die junction temperature.
For both signal integrity and ESD reasons, it is recommended that wide wires are used to connect the thermal diode to the IO pads (in the case of off-chip connectivity). The minimum wire width will depend on process options, and at a minimum must support ESD requirements of the chip and must be of sufficiently low resistance to support precise voltage measurements. A 3-current measurement is recommended to compensate for series resistance in the measurement path.
Functional Specification of Thermal Diode
Block Diagram
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 4nm | N4P | — |
Specifications
Identity
Files
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Provider
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Frequently asked questions about Temperature Sensor IP cores
What is Thermal Diode on TSMC CLN4P?
Thermal Diode on TSMC CLN4P is a Temperature Sensor IP core from Analog Bits Inc. listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this Temperature Sensor?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Temperature Sensor IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.