Vendor: MAXVY Technologies Pvt Ltd Category: Temperature Sensor

Temperature Sensor

The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus.

Overview

The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus.

All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus.

Key features

  • Two wire bus serial interface (I2C and I3C Basic operation modes)
  • Up to 12.5 MHz transfer rate
  • Packet Error Check (PEC) Function
  • Parity Error Check Function
  • Bus Reset Function
  • Two unique addresses selected by SA pin
  • In-band Interrupt (IBI)
  • Supported I3C Basic Common Command Codes (CCC)
    • ENEC
    • DISEC
    • RSTDAA
    • SETAASA
    • GETSTATUS
    • DEVCAP
    • SETHID
    • DEVCTRL

Block Diagram

What’s Included?

  • Verilog Source code
  • User Guide
  • IP Integration Guide
  • Simulation Script
  • Synthesis Script
  • Encrypted UVM Verification Environment
  • cocotb Verification Environment
  • Basic Testsuite
  • Firmware code

Specifications

Identity

Part Number
Temparature Sensor
Vendor
MAXVY Technologies Pvt Ltd
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Frequently asked questions about Temperature Sensor IP cores

What is Temperature Sensor?

Temperature Sensor is a Temperature Sensor IP core from MAXVY Technologies Pvt Ltd listed on Semi IP Hub.

How should engineers evaluate this Temperature Sensor?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Temperature Sensor IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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