UCLe - Ensures reliable validation and efficient connectivity for chiplets
XtremeSilica
•
HQ:
India
UCIe VIP is a solution for validating and ensuring compliance in multi-chip semiconductor systems.
- UCIe
Compare 92 UCIe IP Listing from 31 vendors
-
-
InPsy• HQ: Taiwan (R.O.C.)
The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
- UCIe
-
InPsy• HQ: Taiwan (R.O.C.)
The UCIe-A 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
- UCIe
-
UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 6nm
- N6
-
Synopsys, Inc.• HQ: USA
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 5nm
- N5A
-
UCIe-S PHY for Standard Package (x16) in TSMC N5, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
Synopsys, Inc.• HQ: USA
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-S PHY for Standard Package (x16) in TSMC N4P, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 4nm
- N4P
-
UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 3nm
- N3E
-
UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 3nm
- N3P
-
UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
Synopsys, Inc.• HQ: USA
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-A (Gen2) PHY for Advanced Package (x64) in SS SF4X, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-S PHY for Standard Package (x16) in SS SF2, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-A PHY for Advanced Package (x64) in SS SF2, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-A (Gen2) PHY for Advanced Package (x64) in Intel 18A, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- Intel Foundry
- 18A
- 18A
-
UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 3nm
- N3P
-
UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
-
UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
Synopsys, Inc.• HQ: USAThe UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 3nm
- N3E