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from 5 vendors
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BoW Verification IP
- Support AXI5-Lite D-64 Interface Profile
- Support AXI5-Lite D-32 Interface Profile
- Support PIPE interface PHY to upper layers(System Interface)
- Support LPIF interface PHY to upper layers(System Interface)
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UCIe and BOW Universal PHY
- Novel Redundancy for Hi-Rel,
- Support for 16&18-bit wide data,
- Support Synchronous Operation,
- Supports Advanced packaging,
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2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
- High Bandwidth Density and Data Rates
- Package Configurability
- Energy Efficiency
- Fully Integrated Solution
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Die-to-Die PHY
- The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and are available on both standard and advanced packaging.
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Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
- High data rate of 2–24 Gb/s
- Very low power of < 0.375 pJ/bit @ 2–16 Gb/s 0.5-V VDDQ
- Very low latency of < 2 ns PHY-to-PHY
- Support for 2:1, 4:1, 8:1, 12:1 and 16:1 serialization and deserialization ratios