Vendor: NTLab Category: High-Speed

3.125 Gbps DDR 1-channel CML transmitter

065TSMC_CML_02 core logic interface includes signal pins (INP1, INP2 and INN1, INN2) for data transmission, control pin EN_TX to …

TSMC 65nm GP Silicon Proven View all specifications

Overview

065TSMC_CML_02 core logic interface includes signal pins (INP1, INP2 and INN1, INN2) for data transmission, control pin EN_TX to configure transmitter state and control pin EN_PR to toggle pre-emphasis mode. Data on signal pins INP2 and INN2 should be one bit shifted (delayed) from that on INP1 and INN1 for pre-emphasis purposes. Differential CML output pins PAD_OUTP and PAD_OUTN should be connected to bonding pads.

Key features

  • TSMC CMOS 0.065 um
  • 1.2 V digital power supply
  • 1.2 V CMOS output logic signals
  • 8-step (3-bit) adjustable transmitter output current (range from 4 mA to 32 mA)
  • 3.125 Gbps (DDR MODE) switching rates
  • Temperature range: -40 °C to + 125 °C
  • Optimized for pad-limited layout design
  • Portable to other technologies (upon request)

Block Diagram

Applications

  • Point-to-point data transmission
  • Multidrop buses
  • Clock distribution
  • Backplane receiver
  • Backplane data transmission
  • Cable data transmission

What’s Included?

  • Schematic or NetList
  • Abstract model (.lef and .lib files)
  • Layout view (optional)
  • Behavioral model (Verilog)
  • Extracted view (optional)
  • GDSII
  • DRC, LVS, antenna report
  • Test bench with saved configurations (optional)
  • Documentation

Silicon Options

Foundry Node Process Maturity
TSMC 65nm GP Silicon Proven

Specifications

Identity

Part Number
065TSMC_CML_02
Vendor
NTLab
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Lithuania

Learn more about High-Speed IP core

Frequently asked questions about High-Speed I/O Pad IP

What is 3.125 Gbps DDR 1-channel CML transmitter?

3.125 Gbps DDR 1-channel CML transmitter is a High-Speed IP core from NTLab listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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