UCIe IP
UCIe IP Cores (Universal Chiplet Interconnect Express) facilitate high-bandwidth communication between heterogeneous chiplets, in a single package.
The UCIe™ physical layer includes the link initialization, training, power management states, lane mapping, lane reversal, and scrambling. The UCIe™ controller includes the die-to-die adapter layer and the protocol layer. The adapter layer ensures reliable transfer through link state management and parameter negotiation of the protocol and flit formats. The UCIe™ architecture supports multiple standard protocols such as PCIe, CXL and streaming raw mode.
Explore our vast directory of UCIe IP Cores below.
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UCIe IP
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UCIe IP
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- Samsung
- 5nm
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2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
- High Bandwidth Density and Data Rates
- Package Configurability
- Energy Efficiency
- Fully Integrated Solution
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UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange
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Die-2-die interfaces for chiplets
- Analog I/Os
- ESD Power protection
- Ground pads
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UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange