Overview
The Synopsys HBM2/HBM2E PHY is a complete physical layer IP interface (PHY) solution for high-performance computing (HPC), graphics,
and networking ASIC, ASSP, and system-on-chip (SoC) applications requiring high-bandwidth HBM2/HBM2E SDRAM interfaces operating at up to 3600 Mbps. The Synopsys IP HBM2/HBM2E PHY is ideal for systems with low to modest memory capacity that require higher bandwidth than is attainable with practical DDR4-based systems.
The Synopsys IP HBM2/HBM2E PHY is provided as a set of hard macrocells delivered as GDSII. These hard macrocells include integrated application- specific HBM2/HBM2E I/Os required for HBM2/HBM2E signaling. The design is optimized for high performance, low latency, low area, low power, and ease of integration. The hard macrocells are easily assembled into a complete 1024-bit HBM2/HBM2E PHY. The RTL-based PHY Utility Block (PUB) supports the GDSII-based PHY components and includes the PHY training circuitry, configurations registers and BIST control. The HBM2/HBM2E PHY includes a DFI 4.0-compatible interface to the memory controller, supporting 1:1 and 1:2 clock ratios. The design is compatible with both metal-insulator-metal (MIM) and non-MIM power decoupling strategies.
Learn more about HBM IP core
As artificial intelligence (AI) reshapes industries and advances technological frontiers, its success hinges on advanced memory capabilities. Leading this transformation is High Bandwidth Memory (HBM), which offers unparalleled speeds and efficiencies.
Marc Greenberg
After more than three decades, the relationship between Arm and Synopsys continues to redefine the semiconductor industry. And the fusion of our expertise and technology continues to reshape chip design flows.
With more than 25 years of experience in delivering field-proven silicon IP solutions, we are thrilled to partner with NVIDIA and the NVIDIA NVLink ecosystem to enable and accelerate the creation of custom AI silicon. This strategic collaboration will leverage Synopsys' expertise in silicon IPs to assist in the development of bespoke AI silicon, forming the foundation for advanced compute clusters aimed at delivering the next generation of transformative AI experiences.
Maximize limited package pins with IO that can act as high-speed test ports then be reused as low-power GPIOs during field operation.