Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for copper pillar bump Flip chip version ; UMC 40nm LP LowK Logic Process
- Controller + PHY + 1
- UMC
- 40nm
- LP
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for copper pillar bump Flip chip version ; UMC 40nm LP LowK Logic Process
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY supporting 2-rank application for Copper Pillar Bump Flip Chip Version…
DDR3 RTL Digitalize PHY DATA block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY DATA block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY AC block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
DDR3 RTL Digitalize PHY AC block; UMC 28nm HPC/RVT Logic Process using FSJ0C_ARS
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for SIP Application; UMC 28nm HPC/RVT LowK Logic Process; Vertical v…
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
40nm LPDDR3-PHY Data block for LightCo ; UMC 40nm LP/LVT Logic Process
40nm LPDDR3-PHY Data block for LightCo ; UMC 40nm LP/LVT Logic Process
LPDDR3-PHY Command/address block for LightCo ; UMC 40nm LP/RVT Logic Process
LPDDR3-PHY Command/address block for LightCo ; UMC 40nm LP/RVT Logic Process
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR34 COMBO PHY ADDR Block for Solder bump Flip chip version ;UMC 40nm LP/RVT Logic Process
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), data block;UMC 40nm LP/RVT LowK Logic Process .
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), command / address block,UMC 40nm LP/RVT LowK Logic Process.
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process