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As Low Earth Orbit (LEO) satellite networks target mass-market broadband, mobility and enterprise services, the chipset inside the user terminal – not only the constellation in orbit –will determine the achievable cost, power consumption and production scale
The centre initially plans to recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica’s engineering presence in the European Union and enabling closer participation in European space, semiconductor and communications initiatives.
Europe can strengthen semiconductor sovereignty by investing beyond fabs in design, IP, skilled talent, and product companies.
EnSilica plc , a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce a new 7 year manufacturing and supply contract to produce an Arm based sensing chip for a German manufacturer of automotive components.
Functional safety must be addressed alongside cybersecurity and AI from the earliest stages of silicon design.
EnSilica is pleased to announce its participation in the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the Department for Science, Innovation & Technology (“DSIT”).