Vendor: HCL Technologies Category: Voltage Reference

Band Gap Reference

The designated IP is a very low power, high precision band gap reference circuit intended for integration into 130nm CMOS technol…

Overview

The designated IP is a very low power, high precision band gap reference circuit intended for integration into 130nm CMOS technology System on Chips. The low power bandgap limits the current consumption to 15μA and reference voltage variation to less than 3% over a temperature range of -40 to 125 deg C and over a wide range of voltage supply.

Key features

  • Fully integrated, compact design
  • +/- 3% Accuracy.
  • 3.3V± 10% power supply
  • Low current consumption (15µA).
  • No need of external capacitors.
  • CMOS 130nm 1P8M,3.3V IO MOS

Benefits

  • Very low current consumption (15 μA).
  • Fast time to market

What’s Included?

  • GDSII & CDL Netlist
  • .lef for PnR
  • Datasheet
  • Technical Reference Manual, Design Document

Specifications

Identity

Part Number
HCLBGR160310
Vendor
HCL Technologies
Type
Silicon IP

Provider

Learn more about Voltage Reference IP core

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Low Power Design in SoC Using Arm IP

This paper discusses about the low power IP components from ARM can help one to realize the low power features in the SoC. It should be noted that this paper does not discuss about the low power concepts or design techniques. Rather, it focuses on the implementation approaches using ARM low power IP.

Frequently asked questions about Voltage Reference IP cores

What is Band Gap Reference?

Band Gap Reference is a Voltage Reference IP core from HCL Technologies listed on Semi IP Hub.

How should engineers evaluate this Voltage Reference?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Voltage Reference IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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