Band Gap Reference

This paper deals with the implementation of UPF for low power SoC design that can encompass several vendor IPs and custom IPs UPF constraints.

This paper discusses about the low power IP components from ARM can help one to realize the low power features in the SoC. It should be noted that this paper does not discuss about the low power concepts or design techniques. Rather, it focuses on the implementation approaches using ARM low power IP.

This white paper will discuss the design challenges that IC designers are facing when developing the new GDDR 7 high-performance memory interface and highlight some of the possible solutions to overcome these challenges, ensuring compliance and robustness of the GDDR7 memory interface.

The design of modern Application Specific Integrated Circuits (ASICs) and Systems on a Chip (SoCs) in advanced process nodes can be differentiated by the on-die integration of analog functions, such as power management. Vidatronic offers this white paper to give some historical background on this trend and delve specifically into the integration of power management. Vidatronic IP solutions and the benefits they bring to ASIC and SoC designers are discussed.

Based on the system specification of a typical smart meter, this article demonstrates the importance of carefully selecting the power metering IP solution so that its specification matches the standard requirements and copes with the application challenges. This article then pinpoints thoroughly the various issues that must be taken into account for the selection of the Silicon IP and helps identify the possible trade-offs between the performance of the Mixed-signal Front-end (MFE) and that of the Power and energy Computation Engine (PCE).

System integrators often encounter problems on application boards too late in the design cycle, when bringing together Virtual Components (ViCs of silicon IPs) into a system. Some ViC performances may be degraded at higher levels (SoC and PCB), and thus the final system does not perform as well as expected. In other words, assembling high-performance ViCs together does not guarantee high-performance SoCs or systems when fundamental integration aspects are not addressed or key issues are violated during the integration process.