Learn more about Audio Analog IP core
The virtual validation of subsystem performances (Pop-up Noise, Signal-to-Noise Ratio, Power supply Noise, Power consumption...) requires the modeling and simulation of complete subsystems. Application Hardware Modeling (AHM) consists in addressing the risks of performance degradation while integrating a Silicon IP in its Integrated Circuit (IC) and this IC on its Printed Circuit Board (PCB). The selection of relevant models for a subsystem performance, along with the creation and validation of models through equivalence checking, are the basics of Application Hardware Modeling for right-on-first-pass subsystems!
In this second part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, energy efficiency will be discussed and several means to achieve extra-long playtime will be exposed.
In this fourth part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, the pure audio performance will be discussed.
In mobile electronics, a single device suffices to cover various daily usages: calling, taking pictures, playing music, geolocating, etc… All of these common features should fit in one’s hand. To adequately implement these new functionalities, audio electronics must not be limited to basic plug and play functionalities any longer. Smartphone applications should be compliant with new user practices by enabling more interactivity and giving more possibilities to control the inner functionalities.
This article describes the main automotive application constraints that have an impact on audio performances and thus consumer experience, together with design considerations to be taken care of at silicon Intellectual Property (IP), Systemon- Chips (SoC), application firmware/software and Printed Circuit Board (PCB) levels.
Based on the system specification of a typical smart meter, this article demonstrates the importance of carefully selecting the power metering IP solution so that its specification matches the standard requirements and copes with the application challenges. This article then pinpoints thoroughly the various issues that must be taken into account for the selection of the Silicon IP and helps identify the possible trade-offs between the performance of the Mixed-signal Front-end (MFE) and that of the Power and energy Computation Engine (PCE).
