Vendor: Cadence Design Systems, Inc. Category: DSP Core

Next-generation DSP for embedded vision and AI with millions of units shipped in the market

First DSP for embedded vision and AI with millions of units shipped in the market The Cadence® Tensilica® Vision P6 DSP, introduc…

Overview

512-bit SIMD Vision DSPs for Camera, Radar, and AI

The Cadence® Tensilica® Vision 130 is the successor to the Vision P6 DSP, introduced in 2016. Vision 130 DSP is developed for the newly introduced Tensilca Xtensa LX8 controller. Vision 130 offers the best energy efficiency while offering the performance required for Imaging, Computer Vision, Radar, and AI with its 512-bit SIMD.

Key features

Cadence, through its Tensilica processor IP, brings together best-in-class products and services from industry leaders to help you accelerate the development of your SoC designs while meeting your demanding power and performance requirements. Browse the list of Tensilica processor IP service partners below.

  • 1024/512b Load/Store capabilities
  • 256 8-bit MAC
  • 8/16/32-bit fixed-point processing
  • Single-precision (FP32) and half-precision (FP16) floating-point processing
  • Integrated 3D iDMA
  • User-defined instructions support
  • Built on LX8 Xtensa processor offering best energy efficiency
  • ISO 26262 ready for automotive market

Block Diagram

Benefits

Energy Efficient

Low power compared to host CPU and GPU

Vision/Image Processing

Instruction set optimized for computer vision and image processing applications

High Performance

> 1TOPS AI performance for object detection, image classification, image segmentation

Specifications

Identity

Part Number
Vision 130 DSP
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP

Files

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Provider

Learn more about DSP Core IP core

Role of Time-of-Flight Sensors in Automotive

The automotive sector is undergoing a profound transformation, moving beyond basic detection to a comprehensive, real-time 3D understanding of both the external environment and the vehicle's interior. ToF is emerging as a pivotal technology, offering precise 3D depth and distance information essential for navigating complex environments and understanding in-cabin dynamics.

Building a high-performance, low-power audio/voice subsystem

With the growing popularity of applications such as mobile gaming and voice triggering, the audio/voice subsystem is playing a prominent role in many mobile system-on-chip (SoC) designs. The subsystem must be designed to meet dual demands: high-performance, high-resolution audio stream processing as well as always-on, low-power voice trigger and recognition. Customizable digital signal processing (DSP) and audio/voice subsystem solution intellectual property (IP) blocks can provide a cost-effective and efficient way to develop and deliver high-performance audio/voice products.

Frequently asked questions about DSP Core IP cores

What is Next-generation DSP for embedded vision and AI with millions of units shipped in the market?

Next-generation DSP for embedded vision and AI with millions of units shipped in the market is a DSP Core IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this DSP Core?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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