Vendor: Synopsys, Inc. Category: GPIO

1.8V/3.3V I2C in GF (12nm)

Synopsys Inter-Integrated Circuit (I2C) I/O library is used for two wire interfaces to connect low-speed devices like EEPROM, A/D…

GlobalFoundries 12nm LP Available on request View all specifications

Overview

Synopsys Inter-Integrated Circuit (I2C) I/O library is used for two wire interfaces to connect low-speed devices like EEPROM, A/D, and D/A converters and microcontrollers on the same bus. It is designed for higher I/O voltage supply with support for low core voltage and includes fail-safe and fail-tolerance options.
The following operating modes are supported:

Standard Mode: 100 kHz
Fast Mode: 400 kHz
Fast-Plus Mode: 1 MHz
High-Speed Mode: 3.4 MHz

Key features

  • Input Schmitt trigger
  • Compliance with I2C-bus specification and User Manual–April4, 2014, with I2C operating modes
  • Filter of 50 ns for Spike rejection
  • Automotive G1/G2 supported, ASIL-B certified
  • Silicon validated IP
  • ESD: 2KV HBM, 500V(up to 7A) CDM, Latchup: +/-100mA @ 150C
  • Designed to support multiple metal stack options
  • Support for flip-chip & wirebond packaging

Silicon Options

Foundry Node Process Maturity
GlobalFoundries 12nm LP Available on request

Specifications

Identity

Part Number
dwc_io_in_i2c_12lp_3p3v
Vendor
Synopsys, Inc.
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

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Frequently asked questions about GPIO Pad Library IP cores

What is 1.8V/3.3V I2C in GF (12nm)?

1.8V/3.3V I2C in GF (12nm) is a GPIO IP core from Synopsys, Inc. listed on Semi IP Hub. It is listed with support for globalfoundries Available on request.

How should engineers evaluate this GPIO?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPIO IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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