DDR4 IO for memory PHY, 3200Mbps on SMIC 40nm
The DDR4 IO is used to transfer the Command/Address/Clk and Data between the memory controller PHY and the DRAM device.
Overview
The DDR4 IO is used to transfer the Command/Address/Clk and Data between the memory controller PHY and the DRAM device. The TX is designed to send information from PHY to DRAM and RX is designed to receive information which is from DRAM.
Key features
- Compatible with JESD79-4B
- Data Rate: Up to 3200 Mbps
- Support loopback test
- Support VREFE for VREFCA of DDR4 device
- Support VREFI for internal DQ receiver
- Support retain the IO output
- Programmable On Die Termination:
- DDR4: 240/120/80/60/48/40/34 Ω
- Block cell includes Local Decap and ESD cell
- Process Node: SMIC 40nm
- Operation Temperature: Tj = -40℃ ~ +125℃
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| SMIC | 40nm | 40nm 400 nm | Silicon Proven |
Specifications
Identity
Provider
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Frequently asked questions about High-Speed I/O Pad IP
What is DDR4 IO for memory PHY, 3200Mbps on SMIC 40nm?
DDR4 IO for memory PHY, 3200Mbps on SMIC 40nm is a High-Speed IP core from UniIC listed on Semi IP Hub. It is listed with support for smic Silicon Proven.
How should engineers evaluate this High-Speed?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.