Wipro-NewLogic releases next generation Bluetooth IP

Wipro-NewLogic's Bluetooth® 2.0 + EDR IP is upgradeable by software to next generation Bluetooth 2.1 + EDR and will enable a new range of applications such as high definition audio streaming and transfer of large files. It will significantly increase battery life for applications such as Bluetooth headsets

Lustenau, Austria - July 4, 2007 - Wipro-NewLogic, the semiconductor IP business unit of Wipro Technologies, today announced the release of its Bluetooth 2.0 + EDR baseband RTL and software stack.

This low-power and flexible Bluetooth 2.0 + EDR architecture is upgradeable by software to Bluetooth 2.1 + EDR and builds up on the company's silicon-proven and fully certified Bluetooth 1.2 solution. Combined with the Wipro-NewLogic Bluetooth 2.0 + EDR radio IP, it offers customers a range of system configurations and can be integrated into any application, host or baseband chips, in the mobile, automotive and consumer markets.

"Wipro-NewLogic is a global leader in the Sale of Bluetooth IPs and has a long history in Bluetooth development, being the first company in 2000 to qualify its Bluetooth Core", said Franz Dugand, Product Marketing Manager at Wipro-NewLogic. "We have licensed our Bluetooth 1.2 solution to a large number of customers worldwide and already a few of our customers have taped out their chip, integrating our Bluetooth 2.0 + EDR baseband IP."

Bluetooth 2.0 + EDR technology offers three times higher transfer rates compared to Bluetooth 1.2 technology - 2.1 Megabits per second (Mbps) compared to 721 Kilobits per second (Kbps). This enables a new range of applications like high definition stereo audio streaming, transfer of large files and fast synchronization. Additionally, the Bluetooth 2.0 + EDR technology shows a significant improvement in power consumption over Bluetooth 1.2. Due to the alternative modulation provided by the EDR technology the radio operating in EDR mode will be 3 times less active than a radio operating in Bluetooth 1.2 mode. This results in a significantly higher battery life for applications such as Bluetooth headsets or stereo audio streaming via the A2DP profile from a portable multimedia device to a home or car stereo system.

Wipro-NewLogic's Bluetooth baseband (BOOST™ Core) and software (BOOST™ Software) offer design engineers the flexibility to be used with any 16-bit or 32-bit processor, using little endian or big endian convention. It is silicon proven with ARM, ARC and LEON processors, amongst other CPUs. The BOOST™ Software contains the layers below-HCI (LC, LM, HCI) as well as above HCI, including key profiles such as headset, hands free, HID etc. It supports multiple partitioning options: the hosted configuration allows an easy and standardized partitioning of a Bluetooth system within a two CPU or two chips architecture, while the same software can also be configured in a fully embedded mode, without the need of any HCI.

Wipro-NewLogic is the one stop shop provider of complete wireless solutions, enabling WiFi + Bluetooth combos, Bluetooth over Ultra Wide Band (Bluetooth 3.0) and Bluetooth over Wireless LAN solutions.

About Wipro-NewLogic

Wipro-NewLogic is a leading semiconductor design services provider and supplier of Intellectual Property (IP) cores for complex wireless and wireline applications; thanks to its expertise in complex transceivers, its CMOS RF and its design services capabilities, Wipro has become the partner of choice to design digital, RF and mixed signal CMOS SoCs (system-on-chip).

Wipro-NewLogic's IP portfolio includes Wireless LAN (IEEE 802.11), Bluetooth, Ultra WideBand (UWB), FireWire (IEEE1394) and USB. The IP cores consist of software, digital signal processing & algorithms, silicon proven CMOS radios (RF) and mixed-signal blocks such as AFEs, ADC/DACs, PLLs.

Complementing its IP, Wipro's services cover the design cycle of integrated circuits from A to Z, from feasibility studies to digital/analog/RF design, including the development of complete RF-plus-digital SoCs (system-on-chip) up to GDSII. Wipro also has the capability to take a chip design from GDSII to volume production, managing the entire supply chain to deliver packaged ICs to its customers.

For more information, visit www.wipro-newlogic.com