Exclusive CEO Interview: Latest Funding Drives Ventana's First RISC-V Chiplets in Data Centers
By Nitin Dahad, EETimes (August 15, 2022)
Ever since Ventana Micro Systems came out of stealth last year, the company has been busily developing relationships with partners and potential customers to create traction for its RISC-V–based chiplets, which it believes will address the high-performance computing demands in data centers and at the edge.
Now, the company has raised $55 million in new funding to productize its chiplets based on open standard die–to–die (D2D) interfaces.
The excitement and enthusiasm Balaji Baktha, founder and CEO of Ventana, has for chiplets solving the computing challenges created by the demands in data center, automotive, and 5G is very apparent. EE Times heard it firsthand, in an exclusive interview with the CEO at the recent 59th Design Automation Conference (DAC) in San Francisco.
To read the full article, click here
Related Semiconductor IP
- RISC-V IOPMP IP
- RISC-V Debug & Trace IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- 64-bit RISC-V core with in-order single issue pipeline. Tiny Linux-capable processor for IoT applications.
- Tiny, Ultra-Low-Power Embedded RISC-V Processor
Related News
- SiFive’s New RISC-V IP Combines Scalar, Vector and Matrix Compute to Accelerate AI from the Far Edge IoT to the Data Center
- SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion
- Ventana Micro Systems Inc. Announces Strategic Partnership With Intel for Broader Commercialization of Its High-Performance RISC-V Cores and Chiplets
- Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release