TSMC Sues Over Trade-Secret Leak to Samsung
Alan Patterson, EETimes
2/6/2015 09:28 AM EST
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, is suing a former R&D employee on the suspicion that he leaked secrets including but not limited to 28 nm process technology to Samsung. South Korea’s largest company is a growing competitor in the foundry business.
“We brought the lawsuit because TSMC Chairman Morris Chang and senior management were convinced we needed to send a message to Samsung, employees and other competitors,” Dick Thurston, former chief counsel for TSMC, told EE Times. “The initial technology they focused on was 28 nm.”
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment
- Movellus Brings Power Optimization IP to Samsung Electronics’ Advanced Nodes
- Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors
- ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools