TSMC shuns high-NA EUV lithography
By Peter Clarke, eeNews Europe | April 29, 2025
Foundry TSMC does not need to use high-NA extreme ultraviolet lithography tools for the manufacture of chips on its A14 (1.4nm) process according to reports from the TSMC North America Technology Symposium.
The company introduced the A14 process at the symposium saying it is expected to enter production in 2028. It has previously been stated that an A16 process due to appear late 2026 and that too does not require a high-NA EUVL tool.
To read the full article, click here
Related Semiconductor IP
- MIPI C‑PHY/D‑PHY IP on TSMC N2P
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
Related News
- TSMC Says Immersion Lithography Nearly Production Ready
- MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond
- IMEC presents functional 22nm SRAM cells fabricated using EUV technology
- Synopsys and TSMC Deliver Accurate Lithography Verification for 28nm Designs
Latest News
- StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
- ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’