TSMC shuns high-NA EUV lithography
By Peter Clarke, eeNews Europe | April 29, 2025
Foundry TSMC does not need to use high-NA extreme ultraviolet lithography tools for the manufacture of chips on its A14 (1.4nm) process according to reports from the TSMC North America Technology Symposium.
The company introduced the A14 process at the symposium saying it is expected to enter production in 2028. It has previously been stated that an A16 process due to appear late 2026 and that too does not require a high-NA EUVL tool.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
- TSMC Says Immersion Lithography Nearly Production Ready
- MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond
- IMEC presents functional 22nm SRAM cells fabricated using EUV technology
Latest News
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- Orthogone Technologies Launches Ultra-Low-Latency FPGA IP Portfolio for Multi-Industry Deterministic Networking
- TIER IV joins Arm Total Design for Physical AI to accelerate ready-to-use Autoware solutions through Open AD Kit
- SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
- ICTK to Acquire Network Security Firm withnetworks, Expanding from Security Chips into Global Enterprise Security Solutions