TSMC shuns high-NA EUV lithography
By Peter Clarke, eeNews Europe | April 29, 2025
Foundry TSMC does not need to use high-NA extreme ultraviolet lithography tools for the manufacture of chips on its A14 (1.4nm) process according to reports from the TSMC North America Technology Symposium.
The company introduced the A14 process at the symposium saying it is expected to enter production in 2028. It has previously been stated that an A16 process due to appear late 2026 and that too does not require a high-NA EUVL tool.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
- TSMC Says Immersion Lithography Nearly Production Ready
- MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond
- IMEC presents functional 22nm SRAM cells fabricated using EUV technology
Latest News
- CAST Introduces 100 Gbps TCP/IP Hardware Stack IP Core for High-Performance ASIC and FPGA Designs
- ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
- Arm brings the ecosystem together to build and define the next phase of physical AI
- Arm introduces new AI-native compute platform built for agentic AI and mobile graphics
- Arm expands AI infrastructure for the agentic era with AGI CPU and Neoverse CSS N4