TSMC's Chip Scaling Efforts Reach Crossroads at 2nm
By Alan Patterson, EETimes (June 7, 2021)
Perpetuating Moore’s Law — the observation that the transistor density in a typical chip doubles every two years — poses a number of challenges at the 3nm node, yet Taiwan Semiconductor Manufacturing Corp. (TSMC) remains optimistic.
There are many predictions Moore’s Law is likely to hit a wall soon, but “how soon?” is open to debate. Also, there are technologies that promise ongoing increases in performance that are not dependent on doubling transistor density. The timing of all that will have far-reaching implications. At last week’s TSMC 2021 Technology Symposium, TSMC CEO C. C. Wei gave the example of data centers, which consume over one percent of global electricity generated.
“Estimates suggest global electricity usage from data centers is projected to grow from five to forty times between 2010 to 2030. Why do projections vary so widely?” Wei asked. “Divergent estimates are partly due to the difficulty of making an accurate projection of our footprint. There are too many variables to consider, including whether Moore’s Law can continue.”
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
- OpenAI Reportedly to Finalize In-House AI Chip Design Soon, Set for TSMC’s 3nm Production
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release