TSMC plots system super chips
R Colin Johnson, EETimes
5/13/2013 4:04 PM EDT
Taipei, Taiwan -- The world's leading semiconductor foundry, Taiwan Semiconductor Manufacturing Company, (TSMC) recently detailed its plans to dominate the "system super-chip" market in an exclusive EE Times interview with its chief technology officer and vice president of R&D, Jack Sun.
"If anybody pushes Moore's Law to extremes, TSMC will be there too, but that is not all we do," said Sun. "We also have specialized technologies such as embedded flash, high-voltage, power transistors, MEMS and image sensors -- a spectrum of technologies
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips
- ASICLAND to Showcase AxHub™ and Mass-Produced Chips at TSMC OIP Forum
- QuantWare launches Foundry Services for superconducting quantum chips
- BSC presents Sargantana, the new generation of the first open-source chips designed in Spain
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools