TSMC plots system super chips
R Colin Johnson, EETimes
5/13/2013 4:04 PM EDT
Taipei, Taiwan -- The world's leading semiconductor foundry, Taiwan Semiconductor Manufacturing Company, (TSMC) recently detailed its plans to dominate the "system super-chip" market in an exclusive EE Times interview with its chief technology officer and vice president of R&D, Jack Sun.
"If anybody pushes Moore's Law to extremes, TSMC will be there too, but that is not all we do," said Sun. "We also have specialized technologies such as embedded flash, high-voltage, power transistors, MEMS and image sensors -- a spectrum of technologies
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips
- QuantWare launches Foundry Services for superconducting quantum chips
- BSC presents Sargantana, the new generation of the first open-source chips designed in Spain
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board