TSMC Capex to Exceed $10B in FinFET Ramp-Up
Alan Patterson, EETimes
10/16/2014 09:30 AM EDT
“Progress is much better than our original plan,” TSMC co-CEO C.C. Wei said at an investor conference to announce the company’s third-quarter 2014 earnings. “Sixteen-nanometer has achieved the best technology and maturity compared to all TSMC’s previous nodes.”
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Silicon Logic Engineering Launches ASICBlaster Chip Design Services Solution to Facilitate Semiconductor Industry Ramp-Up
- Monterey Design And Artisan Components To Deliver Integrated Solution To Help Reduce Ramp-Up Time For Advanced Processes
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board