Silicon-proven HBM Gen2 Hardened PHY from eSilicon
14LPP and 28HPC high-bandwidth memory PHY now available
SAN JOSE, Calif. — December 15, 2016 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the availability of its silicon-proven 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY solution.
High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).
eSilicon’s HBM Gen2 PHY has been developed to JEDEC JESD235B specification on Samsung 14LPP and TSMC 28HPC technologies. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O. The integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel.
The HBM PHY is DFI 4.0 compliant with several controller-independent features such as:
- READ/WRITE/CK strobe training
- READ leveling training
- I/O calibration
- Lane repair
- Independent programmable control/status registers (CSRs) via APB or IEEE1500 interface
- MISR test
- The PHY may be integrated with any controller
“We are delighted with our complete 2.5D HBM solution,” said Lisa Minwell, eSilicon’s senior director, IP marketing. “eSilicon is delivering a low-risk solution with comprehensive silicon PPA characterization, reliability and test. Our interposer design with full electrical, thermal and mechanical analysis further reduces risk.”
eSilicon has been researching and developing products and processes that deliver a complete 2.5D HBM solution since 2011. eSilicon’s end-to-end HBM solution includes 2.5D ecosystem management, the PHY, ASIC design, SiP design, manufacturing, assembly and test.
Please contact eSilicon at ipbu@esilicon.com for more information, silicon quality results, white papers or data sheets. Or you can download the HBM Gen2 PHY brief.
About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the automotive, communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com
Related Semiconductor IP
- TSMC CLN5FF HBM PHY IP
- TSMC CLN16FFGL+ HBM PHY IP
- HBM 4 Verification IP
- Verification IP for HBM
- Simulation VIP for HBM
Related News
- HiSilicon Licenses eSilicon's 40nm Silicon-Proven TCAMs for High-Performance Network Chips
- eSilicon, Northwest Logic and SK Hynix create high-bandwidth memory (HBM) hardware demonstration
- Open-Silicon Announces Comprehensive High Bandwidth Memory (HBM) Gen2 IP Subsystem Solution
- T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA