QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge
SAN JOSE, Calif., May 5, 2026 -- QuickLogic Corporation (NASDAQ: QUIK) will showcase its EOS™ S3 SoC and eFPGA solutions at Sensors Converge 2026, taking place at the Santa Clara Convention Center. Attendees can visit Booth 1039 to see how developers can build always-on, ultra-low power sensor and voice-enabled systems with greater flexibility and faster time-to-market.
At the booth, QuickLogic will highlight the EOS™ S3, a fully integrated platform designed for concurrent voice, motion, environmental, and biometric sensing. With its built-in low-power sound detection, Arm® Cortex®-M4F processor, and embedded FPGA, the EOS™ S3 enables developers to implement custom hardware acceleration while minimizing power consumption—ideal for battery-operated and always-on applications.
Explore eFPGA IP:
Date: May 6 and 7, 2026
Booth: 1039
Exhibit Hours:
- Wednesday, May 6: 10:00 AM – 5:30 PM
- Thursday, May 7: 10:00 AM – 4:00 PM
About QuickLogic
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit www.quicklogic.com.
Related Semiconductor IP
- Radiation-Hardened eFPGA
- eFPGA Hard IP Generator
- eFPGA IP — Flexible Reconfigurable Logic Acceleration Core
- eFPGA Soft IP
- eFPGA on GlobalFoundries GF12LPP
Related News
- QuickLogic, SparkFun and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit
- C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement
- QuickLogic Collaborates with ETH Zurich to Integrate eFPGA into PULP Platform
- QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process
Latest News
- Siemens and TSMC advance AI-powered semiconductor design automation
- Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes
- Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design
- Logic Fruit Technologies Unveils L‑QNTX Security Platform for HSMs, Silicon and Embedded Systems
- IC-Link by imec expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support