Huawei, Altera mix FPGA, memory in 2.5-D device
Rick Merritt, EETimes
11/14/2012 6:59 PM EST
The new device, in the works only about three months, will significantly reduce board space while increasing performance. “2.5D silicon interposers seem to be the best fit for networking companies—in fact, they are mission critical,” said Anwar A. Mohammed, a senior staff scientist for packaging working in Huawei’s U.S. R&D center here.
To read the full article, click here
Related Semiconductor IP
- Aurora-like 64b/66b @14Gbps for ALTERA Devices
- Aurora-like 8b/10b @3Gbps for ALTERA Devices
- SATA Device Controller on Altera Arria II GX
- SATA Host on Altera Arria II GX
- eCPRI Altera® FPGA IP
Related News
- Altera Starts Production Shipments of Industry’s Highest Memory Bandwidth FPGA
- Intel Launches Altera, Its New Standalone FPGA Company
- 30 minutes with Altera CEO Sandra Rivera discussing the Past, Present, and Future of a major FPGA vendor
- Lattice Expands Low Power, Small FPGA Portfolio with High I/O Density and Secure Device Options
Latest News
- Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology