Cadence TSMC, ARM call for more collaboration
Rick Merritt, EETimes
3/13/2012 4:23 PM EDT
“Silicon integration and complexity will be a real challenge,” said Lip-Bu Tan, chief executive of Cadence, noting 20 nm chips with eight billion transistors in the works.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- Cadence to Acquire Arm Artisan Foundation IP Business
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
Latest News
- Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company
- UMC Reports Sales for June 2026
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan