Altera and TSMC Jointly Develop World's First Heterogeneous 3D IC Test Vehicle Using CoWoS Process
2012-03-22 15:16:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 971 of 1948
Broadcom Extends Fiber Access Portfolio with Acquisition of BroadLight
2012-03-22 14:35:00
Strategic Partnerships
Synopsys Extends Leadership in Storage Standards Verification IP with NVM Express
2012-03-22 14:22:00
Verification IP
Test and Verification Solutions opens its branch office at Bengaluru, India
2012-03-22 11:06:00
Strategic Partnerships
GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer
2012-03-22 07:39:00
Foundries & Process Nodes
Tilera and AuthenTec Team to Deliver Highest Performance, Most Efficient IPsec Solution
2012-03-21 15:20:00
SoC Architecture & Assembly
Synopsys Unveils Virtualizer Development Kits to Accelerate Software Development for ARM big.LITTLE Processing
2012-03-21 14:12:00
EDA & Design Tools
After Hitting 11-Year High in Q4, Semiconductor Inventories Set to Decline Slightly in Q1
2012-03-21 13:28:00
Analysis & Insight
Cadence Delivers High-Performance, Low-Power Design IP Supporting LPDDR3 Memory Standard
2012-03-21 13:09:00
IP Cores & Design
ISSI Signs SRAM Technology Licensing Agreement with IBM
2012-03-21 11:47:00
Strategic Partnerships
Polaris Design Acquires ASIC/SoC Prototyping Business of IRIS Technologies and Appoints PROTOtyping Japan as Its Exclusive Japan Distributor
2012-03-21 10:52:00
Strategic Partnerships
Semtech Completes Acquisition of Gennum Corporation
2012-03-21 10:46:00
Strategic Partnerships
Cadence Opens Expanded Shanghai Sales Office and R&D Center
2012-03-21 01:24:00
Strategic Partnerships
ASIC Design Starts: New Growth Ahead
2012-03-20 23:16:00
Analysis & Insight
S3 Group Selected to Power New Generation of Iridium Communications Devices
2012-03-20 15:23:00
Misc
Ittiam Revenue Crosses US$20 Million with Royalties Contributing Over 35%
2012-03-20 14:02:00
Financials
Xilinx Inaugurates Expanded Site in Hyderabad for R&D, Technical Support
2012-03-20 10:48:00
SoC Architecture & Assembly
X-FAB Extends High-Temperature Capability to 0.18 Micrometer Platform for Unique Combination of High Voltage, High Temperature and NVM Features
2012-03-20 09:30:00
Foundries & Process Nodes
eMemory and HLMC Cooperate on High-Voltage Advanced Fabrication Platform
2012-03-20 08:11:00
IP Cores & Design
Adapteva close to sampling 28-nm, 64-core coprocessor
2012-03-19 15:58:00
IP Cores & Design