Is China's fabless model sustainable?
2012-06-21 10:30:00
Analysis & Insight
Semiconductor IP News Archive - Page 949 of 1948
SENSIO 3D Decoder integrated in Christie SKA-3D processor
2012-06-21 10:06:00
Commercial Deals
Analog Devices and TSMC Collaborate on New Analog Process Technology Platform
2012-06-21 09:50:00
Foundries & Process Nodes
SK Hynix to Acquire Link_A_Media Devices
2012-06-21 09:48:00
Strategic Partnerships
u-blox Launches GPS SoC Using GLOBALFOUNDRIES 65nm-LPe RF Process Technology
2012-06-21 08:38:00
SoC Architecture & Assembly
Cypress, Nuvation and Arrow Electronics Introduce New USB 3.0 SuperSpeed Interface Board for Altera FPGAs
2012-06-21 08:32:00
Misc
Atrenta Accelerates Growth in Front End Design with Acquisition of NextOp Software, Inc.
2012-06-20 17:46:00
Strategic Partnerships
OptiumIP.com with turnkey DSP accelerator IP cores launched by Recore Systems
2012-06-20 17:44:00
Strategic Partnerships
Tensilica Doubles DSP Shipments, Ranks Second in DSP IP Market According to The Linley Group
2012-06-20 14:15:00
Misc
Rightware Collaborates with Freescale and Vivante to Enable Highly Advanced Automotive In-Vehicle Infotainment and Instrument Cluster Systems
2012-06-20 13:28:00
SoC Architecture & Assembly
Tiempo Announces Silicon Validation of TESIC, Tiempo Secured Platform
2012-06-20 13:04:00
SoC Architecture & Assembly
SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz
2012-06-20 10:41:00
Foundries & Process Nodes
MIPI Alliance and USB 3.0 Promoter Group Announce Availability of SuperSpeed USB Inter-Chip Specification
2012-06-20 10:36:00
Misc
Panel: ARM to dominate consumer apps
2012-06-20 07:55:00
Analysis & Insight
Microsoft picks both ARM and Intel for tablet
2012-06-19 15:38:00
Analysis & Insight
New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation
2012-06-19 14:34:00
SoC Architecture & Assembly
Report: Renesas Mobile up for sale in re-org
2012-06-19 14:22:00
Analysis & Insight
SMIC and AlgolTek Announce the Availability of digniPHY for USB 3.0 on SMIC's 0.13um Technology
2012-06-19 11:30:00
IP Cores & Design
Dresden fab could host 20-nm process, 450-mm wafers
2012-06-19 09:37:00
Foundries & Process Nodes
InterDigital Agrees to $375 Million Patent Transaction with Intel
2012-06-19 09:22:00
Strategic Partnerships