Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013
2013-02-20 12:36:00
Misc
Semiconductor IP News Archive - Page 914 of 1971
Reflex CES Demonstrates SoC FPGA-Based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems
2013-02-20 08:18:00
Misc
Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013
2013-02-20 08:12:00
Analysis & Insight
Rambus Updates First Quarter Revenue Guidance
2013-02-20 08:03:00
Financials
Rambus and LSI Corporation Sign Patent License Agreement
2013-02-20 08:02:00
Commercial Deals
GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage
2013-02-20 07:39:00
Foundries & Process Nodes
Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona
2013-02-20 01:04:00
Misc
ARM and STMicroelectronics Join with Mathworks to Enable Code Generation, Debug and Modelling For STM32 Microcontrollers
2013-02-19 16:41:00
SoC Architecture & Assembly
Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor
2013-02-19 16:21:00
SoC Architecture & Assembly
LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks
2013-02-19 16:00:00
SoC Architecture & Assembly
Kilopass Receives Frost & Sullivan Award for Non-Volatile Memory Innovator
2013-02-19 14:10:00
Misc
CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells
2013-02-19 13:13:00
Commercial Deals
CEVA Introduces MUST Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework
2013-02-19 12:08:00
IP Cores & Design
CAST Adds Multicast and AXI to UDP/IP Core for Streaming Media Systems
2013-02-19 11:34:00
IP Cores & Design
AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable
2013-02-19 09:50:00
SoC Architecture & Assembly
New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
2013-02-19 07:33:00
SoC Architecture & Assembly
Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs
2013-02-19 07:27:00
SoC Architecture & Assembly
CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
2013-02-19 06:17:00
SoC Architecture & Assembly
Lantiq Introduces Lowest Power GPON SoC Solution for SFP Optical Module Form Factor
2013-02-19 01:34:00
SoC Architecture & Assembly
Mentor Graphics Nucleus Innovate Program Adds NXP Semiconductors and Expands Device Support
2013-02-18 15:48:00
SoC Architecture & Assembly