Tata Elxsi unveils H.264 Ultra Low Latency Codecs with 13 ms end to end latency
2013-04-08 09:20:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 897 of 1964
Brite's USB 2.0 OTG PHY Implementation Using SMIC 0.11um Process Receives USB-IF Certification
2013-04-08 09:18:00
IP Cores & Design
Altera Showcases 4K Video Processing and Multichannel Video-over-IP at 2013 NAB Show
2013-04-08 08:54:00
SoC Architecture & Assembly
Tata Elxsi unveils HEVC Ultra HD (4K) Decoder for Smartphones, Tablets, Set Top Boxes, Gaming consoles and other CE devices
2013-04-08 05:24:00
SoC Architecture & Assembly
Open-Silicon Extends its TSMC VCA Partnership to Include Israel
2013-04-08 03:32:00
Strategic Partnerships
Mentor Graphics Announces the First IP to System, UPF-based Low-power Verification Solution
2013-04-08 02:35:00
EDA & Design Tools
ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process
2013-04-05 11:48:00
EDA & Design Tools
JEDEC Publishes Test Standard For Universal Flash Storage (UFS)
2013-04-04 17:42:00
Misc
More Than One Fourth of Industry Wafer Capacity Dedicated to <40nm Process Geometries
2013-04-04 17:31:00
Analysis & Insight
Cryptography Research and StarChip sign patent license agreement for DPA countermeasures
2013-04-04 15:50:00
Legal & IP Strategy
TSMC expected to begin 20-nm line early
2013-04-04 10:14:00
Analysis & Insight
Cisco Announces Intent to Acquire Ubiquisys
2013-04-04 10:12:00
Strategic Partnerships
Yoshida in China: Imagination dumps MIPS sales team
2013-04-04 09:34:00
Analysis & Insight
Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE
2013-04-04 09:21:00
SoC Architecture & Assembly
Worldwide Semiconductor Revenue Declined 2.6 Percent in 2012, According to Final Results by Gartner
2013-04-03 14:02:00
Analysis & Insight
Xilinx Vivado Design Suite Accelerates Time to Integration and System-Level Design to Stay a Generation Ahead
2013-04-03 13:41:00
SoC Architecture & Assembly
China fabless: Actions Semi targets 'non-Apple market'
2013-04-03 10:00:00
Analysis & Insight
Hybrid Memory Cube Consortium Heralds 2013 as Turning Point for High-Performance Memory ICs, Gains Rapid Consensus for Final Specification and Decision to Renew Consortium
2013-04-03 03:52:00
Misc
Accellera Systems Initiative Launches Working Group to Standardize Interoperability of Multiple Language Verification Environments and Components
2013-04-03 01:57:00
EDA & Design Tools
GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology
2013-04-02 15:26:00
Foundries & Process Nodes