DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution
2013-02-25 13:39:00
Commercial Deals
Semiconductor IP News Archive - Page 889 of 1948
MagnaChip Selects Synopsys' Proteus LRC for Lithography Verification
2013-02-25 13:24:00
EDA & Design Tools
MIPI® Alliance and VESA® Announce Liaison to Collaborate on Data Compression Schemes for Mobile Display Applications
2013-02-25 10:17:00
Misc
Silicon Image MHL Technology Featured on New MediaTek Quad-Core Mobile Computing Reference Platform
2013-02-25 09:30:00
Commercial Deals
Sequans introduces LTE-Advanced Chip
2013-02-25 08:56:00
SoC Architecture & Assembly
Imec and Target present multi-standard low-power LDPC engine for multi-Gbps wireless communication
2013-02-25 08:50:00
IP Cores & Design
Tensilica and Sensory Drive Industry's Lowest Power DSP-Based Voice Activation Solution
2013-02-25 08:44:00
SoC Architecture & Assembly
Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
2013-02-25 08:39:00
Commercial Deals
MIPS processor cores power Ceragon Networks' next generation multi-core packet radio
2013-02-25 07:41:00
Commercial Deals
Power efficiency is now the dominant factor in mobile design says Imagination
2013-02-25 04:51:00
Misc
PowerVR G6100 Series6 "Rogue" core enables mass-market OpenGL ES3.0
2013-02-25 04:07:00
IP Cores & Design
LTE and LTE advanced baseband processing get performance boost from MIPS multi-threaded cores
2013-02-25 02:54:00
IP Cores & Design
Expectations set by mobile devices are driving other consumer categories to "get smart", says Imagination
2013-02-25 02:13:00
Misc
CSR Licenses aptX Low Latency Codec to Mad Catz for New Family of Bluetooth Wireless Gaming Headsets
2013-02-25 02:01:00
Commercial Deals
Imagination joins Open Handset Alliance
2013-02-25 01:05:00
Misc
ST-Ericsson brings PC speeds to mobile devices: First 3GHz smartphone prototype demo at Mobile World Congress
2013-02-22 11:02:00
SoC Architecture & Assembly
North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14
2013-02-22 10:52:00
Analysis & Insight
Xilinx and TEKTELIC Reduce Cellular Radio Infrastructure Development Time with Scalable IP and High Performance Transceiver
2013-02-22 10:38:00
SoC Architecture & Assembly
ARM and Synopsys Collaborate to Optimize ARM Mali GPU 20nm Implementation
2013-02-22 10:30:00
EDA & Design Tools
IDT Announces Data Compression IP Offering Industry's Highest Performance for 3G and 4G Wireless Infrastructure Applications
2013-02-21 17:27:00
IP Cores & Design