Dolphin Integration Releases SmartLink, USB adapter for 80x51 Built-in Debugger 2014-02-17 12:12:00 SoC Architecture & Assembly
IBM invests in new $5bn chip fab in India, so is chip sale off? 2014-02-17 10:57:00 Analysis & Insight
Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP 2014-02-14 15:14:00 SoC Architecture & Assembly
Tabula Announces Availability of Stylus Compiler Version 2.8.2 2014-02-14 13:33:00 EDA & Design Tools
CEVA and Sensory Enable Power-Optimized Always-Listening Smart Wearables and Sensor Fusion Solutions via TrulyHandsfree 3.0 for CEVA-TeakLite-4 DSPs 2014-02-14 13:20:00 SoC Architecture & Assembly
CEVA and Visidon Partner to Bring Ultra-low Power Always-on Face Activation Technology to Mobile Devices 2014-02-14 13:06:00 SoC Architecture & Assembly
PathPartner Technology Announces HEVC (H.265) Decoder on ARM Cortex-A Family Processors 2014-02-14 09:51:00 SoC Architecture & Assembly
Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X 2014-02-13 20:38:00 SoC Architecture & Assembly
Sital Delivers Mil-Std-1553 IP core with Multi-RT and Error Injection Capabilities 2014-02-13 14:05:00 IP Cores & Design
Xilinx Celebrates 30 Years, 3500 Patents, and 60 Industry Firsts 2014-02-13 14:00:00 Strategic Partnerships
Cadence Acquires High Speed Interface IP Assets of TranSwitch Corporation, Further Expanding IP Portfolio for Mobile/Consumer Market 2014-02-13 07:19:00 Strategic Partnerships
CEVA to Showcase a Range of Solutions for the Future of Mobile Computing at Mobile World Congress 2014 2014-02-13 02:53:00 Misc