How Small Will Apple Inc. Go?
By Ashraf Eassa, The Motley Fool
February 16, 2014
Taiwan Semiconductor (NYSE: TSM ) has been rather vocal about the fact that it is now in "high volume manufacturing" of its 20-nanometer SoC process. The 20-nanometer process, according to TSMC, offers a 1.9x improvement in gate-density, 15% performance improvement at the same power or 30% lower power at the same performance compared to the company's 28-nanometer HPM process, and is expected to really begin to ramp in volume during the second half of 2014 and into 2015, as shown below.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V Switchable GPIO with I2C, HDMI, LVDS, ESD & Analog in TSMC 28nm
- 10mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- 30mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- 40mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- Real-Time-Clock Analog, Include 32K XOSC, Capaless LDO, POR, VDT - TSMC 28nm
Related News
- How Apple will dodge an Imagination lawsuit
- Reading the tea leaves: How deep will EDA losses go?
- China, Not Apple, Is Way to Go, Says mCube CEO
- How Will Deep Learning Change SoCs?
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release