Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-Processing SoC Technologies 2015-02-23 13:35:00 SoC Architecture & Assembly
CEVA Announces Availability of Enhanced Voice Services (EVS) Codec for its Low Power Audio/Voice DSPs 2015-02-23 13:23:00 SoC Architecture & Assembly
Smart Power Metering: Dolphin Integration first Silicon IP provider to announce range 1/5,000 with 0.05 % accuracy for a complete solution 2015-02-23 09:35:00 IP Cores & Design
Magillem partnering with Imperas: Enabling Internet of Things, using virtual platforms 2015-02-23 09:05:00 EDA & Design Tools
Videantis and gestigon bring gesture recognition and skeleton tracking to the automotive market 2015-02-23 08:59:00 IP Cores & Design
North American Semiconductor Equipment Industry Posts January 2015 Book-to-Bill Ratio of 1.03 2015-02-23 06:40:00 Analysis & Insight
Silicon Storage Technology and UMC Announce Availability of Qualified 55 nm Embedded SuperFlash Memory Platform and 40 nm License 2015-02-23 04:07:00 IP Cores & Design
VESA to Showcase Latest DisplayPort Developments for Mobile Applications at Mobile World Congress 2015-02-23 01:51:00 Misc
eASIC Files Registration Statement for Proposed Initial Public Offering 2015-02-23 01:00:00 Strategic Partnerships
Multicore Association Provides Architecture Description Standard to Enhance Software Tool Support for Multicore and Manycore Processors 2015-02-19 17:13:00 SoC Architecture & Assembly
NXP and Chinese Private Equity firm JianGuang Asset Management to Establish Semiconductor Joint Venture 2015-02-19 14:27:00 Strategic Partnerships
Microsemi Strengthens Leadership in Defense and Security with Category 1A Trusted Supplier Accreditation From DMEA 2015-02-19 09:42:00 SoC Architecture & Assembly
Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools 2015-02-18 19:28:00 EDA & Design Tools
CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs 2015-02-18 18:24:00 Misc
MIPI Alliance Updates its Widely Adopted CSI Specification to Bring High-Resolution Imaging, Richer Color and Video to Mobile and Mobile-Influenced Applications 2015-02-18 18:13:00 Misc
Mindtree Enables Next Generation Bluetooth Low Energy Chips at Cypress 2015-02-18 18:04:00 Commercial Deals