Cypher Partners with CEVA to Offer Innovative Noise Reduction Solution for Mobile, Wearables and Voice-activated Devices 2015-02-27 13:25:00 SoC Architecture & Assembly
Cortus and Oryx enable Internet of Things SoC applications with IP v6 stack running on the full range of Cortus processor cores 2015-02-27 10:43:00 SoC Architecture & Assembly
SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista 2015-02-27 10:26:00 Foundries & Process Nodes
WiLAN Enters into Settlement and License Agreement with Texas Instruments 2015-02-27 10:22:00 Legal & IP Strategy
New EEMBC CoreMark-Pro Benchmark Bumps Processor Benchmarking Capabilities 2015-02-27 10:09:00 SoC Architecture & Assembly
SmartDV Announces Addition of Six New Verification IPs to their Product Portfolio 2015-02-27 09:11:00 Verification IP
Altera and Escape Communications Announce High-capacity Turn-key Modem Solution for E- and V-band Microwave Radios 2015-02-27 08:33:00 IP Cores & Design
ARM Launches Intelligent Flexible Cloud Framework to Shape the Next-Generation Network 2015-02-27 08:19:00 SoC Architecture & Assembly
Blunk Microsystems offers CrossStep IDE for Cortus Software Development 2015-02-27 03:41:00 SoC Architecture & Assembly
ARM Unveils Advanced Technology to Accelerate Game Development at the Game Developers Conference (GDC) 2015 2015-02-27 03:21:00 Misc
Brite Semiconductor Improves Quality of Results and Reduces Time to Market for Four SoC Designs with Cadence Digital Implementation and Signoff Tools 2015-02-27 01:38:00 EDA & Design Tools
Cavium and ARM To Demonstrate Comprehensive Cloud RAN Application on 48 Core 64-bit ARMv8-A ThunderX SoC Processor at Mobile World Congress 2015 2015-02-26 16:01:00 SoC Architecture & Assembly
Synopsys' embARC Open Software Platform Accelerates Development of ARC-based Embedded Systems for the Internet of Things 2015-02-26 15:11:00 SoC Architecture & Assembly
Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs 2015-02-26 09:16:00 EDA & Design Tools
Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer 2015-02-26 09:12:00 EDA & Design Tools
INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015 2015-02-26 07:42:00 SoC Architecture & Assembly
Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT) 2015-02-25 17:15:00 Commercial Deals