Creonic Announces FMC Board with L-Band RF Input for Satellite Applications
2017-01-09 11:44:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 619 of 1971
Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP
2017-01-09 03:56:00
SoC Architecture & Assembly
Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
2017-01-09 01:57:00
Commercial Deals
Imagination appoints industry expert to lead PowerVR business unit
2017-01-05 17:42:00
People & Leadership
Imagination collaborates with Socionext on advanced video and display technologies
2017-01-05 17:40:00
Commercial Deals
MIPS I6500 CPU sub-system with NetSpeed's Gemini IP provides highly efficient processing for vision applications
2017-01-05 15:41:00
Commercial Deals
Wi-Fi CERTIFIED TimeSync brings precise synchronization to Wi-Fi devices
2017-01-05 15:27:00
Misc
AndesCore Ultra Low-Power, High Performance N705 CPU Core Wins Design Socket In Sino Wealth Electronic's New Bluetooth Low Energy Chip Design
2017-01-05 15:20:00
Commercial Deals
Waves Nx Now Available on ARM-Based Platforms
2017-01-05 15:16:00
SoC Architecture & Assembly
DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions
2017-01-05 13:50:00
SoC Architecture & Assembly
Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
2017-01-05 13:48:00
Commercial Deals
GUC Monthly Sales Report - December 2016
2017-01-05 10:07:00
Financials
Apple joins SoftBank's Vision Fund with $1 billion investment
2017-01-05 09:36:00
Analysis & Insight
VESA Rolls Out Early Certification Program for Video Source and Display Products Using HBR3 High-Bandwidth Link Rate
2017-01-05 09:06:00
Misc
Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer
2017-01-05 08:49:00
Misc
Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology
2017-01-05 08:39:00
SoC Architecture & Assembly
HDMI Forum Announces Version 2.1 of the HDMI Specification
2017-01-05 05:21:00
Misc
Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
2017-01-05 03:58:00
SoC Architecture & Assembly
Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
2017-01-04 17:14:00
SoC Architecture & Assembly
ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS
2017-01-04 13:07:00
Commercial Deals