Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
2017-02-23 17:02:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 598 of 1958
Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP
2017-02-23 17:00:00
SoC Architecture & Assembly
Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT
2017-02-23 16:07:00
Commercial Deals
Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
2017-02-23 15:45:00
Analysis & Insight
UMC Enters Mass Production for 14nm Customer ICs
2017-02-23 10:04:00
Foundries & Process Nodes
Neowine selects Barco Silex public key cryptography IP as most efficient hardware block
2017-02-23 09:52:00
Commercial Deals
Goke Licenses SonicsGN and MemMax Products for STB SoC Platform
2017-02-23 08:05:00
Commercial Deals
CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
2017-02-23 07:30:00
IP Cores & Design
Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols
2017-02-22 18:31:00
Verification IP
Blu Wireless Technology secures backing from ARM
2017-02-22 14:15:00
Strategic Partnerships
SST Announces Qualification of Embedded SuperFlash on 110 nm CMOS Process
2017-02-22 14:09:00
IP Cores & Design
Silab Tech wins the "SME of the Year" Award at the Small Enterprise Business Awards 2016.
2017-02-22 12:27:00
Misc
First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP
2017-02-21 16:57:00
IP Cores & Design
Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP
2017-02-21 16:52:00
IP Cores & Design
GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications
2017-02-21 14:18:00
Foundries & Process Nodes
Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology
2017-02-21 13:19:00
SoC Architecture & Assembly
Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets
2017-02-21 13:06:00
SoC Architecture & Assembly
Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP
2017-02-21 08:12:00
Commercial Deals
Cyberon and Andes Collaborate on Voice Interface Solutions for IoT Devices
2017-02-21 07:32:00
SoC Architecture & Assembly
Synopsys IC Compiler II Sets the Bar in Quality-of-Results
2017-02-21 06:11:00
EDA & Design Tools