Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
2020-10-20 15:31:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 358 of 1957
Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
2020-10-20 15:08:00
EDA & Design Tools
TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
2020-10-20 14:33:00
Foundries & Process Nodes
Cadence Reports Third Quarter 2020 Financial Results
2020-10-20 10:16:00
Financials
SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
2020-10-20 08:43:00
Misc
TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
2020-10-20 08:29:00
IP Cores & Design
SK hynix to Acquire Intel NAND Memory Business
2020-10-20 06:17:00
Strategic Partnerships
Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
2020-10-19 15:28:00
EDA & Design Tools
Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency
2020-10-19 15:08:00
IP Cores & Design
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
2020-10-19 13:46:00
Commercial Deals
Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
2020-10-19 12:40:00
Misc
Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
2020-10-19 08:17:00
EDA & Design Tools
Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
2020-10-19 02:24:00
Strategic Partnerships
TSMC Reports Third Quarter EPS of NT$5.30
2020-10-15 16:31:00
Financials
GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
2020-10-15 15:27:00
Foundries & Process Nodes
CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
2020-10-15 11:04:00
IP Cores & Design
Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
2020-10-15 08:42:00
SoC Architecture & Assembly
Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
2020-10-15 06:38:00
Analysis & Insight
JEDEC Announces Publication of JEDEC Module Sideband Bus
2020-10-15 02:00:00
Misc
GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
2020-10-15 01:25:00
SoC Architecture & Assembly