Cadence Announces $100 Million Accelerated Share Repurchase Agreement
2022-06-21 03:08:00
Misc
Semiconductor IP News Archive - Page 261 of 1970
SiFive Enhances Popular X280 Processor IP to Meet Accelerated Demand for Vector Processing
2022-06-21 01:24:00
IP Cores & Design
World's First AV1 Decoder Silicon IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
2022-06-20 15:56:00
IP Cores & Design
Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
2022-06-20 15:26:00
IP Cores & Design
World's first end-to-end integration of ZKP with FPGAs.
2022-06-20 15:04:00
IP Cores & Design
Samsung Ventures invests in Israeli AI systems and semiconductor company NeuReality
2022-06-20 13:54:00
Strategic Partnerships
Complete UFS 3.1 Controller solution (Analog / Digital IP Cores) licensed to China's leading Smartphone Company
2022-06-20 10:05:00
Misc
VisualSim Antenna System Designer enables simulation of Antenna and Communication Systems
2022-06-20 05:59:00
EDA & Design Tools
Huawei and Nordic cellular IoT licensing deal takes a big step towards industry-wide component-level licensing
2022-06-20 03:37:00
Strategic Partnerships
TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium
2022-06-17 08:22:00
Foundries & Process Nodes
Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow
2022-06-17 08:20:00
EDA & Design Tools
Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process
2022-06-17 08:15:00
EDA & Design Tools
Embedded World fair: Menta will unveil an unprecedented collaboration with Everspin Technologies
2022-06-17 06:01:00
Strategic Partnerships
OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
2022-06-16 16:41:00
Misc
Alchip Technologies Offers 3nm ASIC Design Services
2022-06-16 16:40:00
Misc
Avery Design Systems Announces Verification Support for New UCIe standard, Accelerating Adoption of Chiplet Interconnect Protocol
2022-06-16 16:40:00
Verification IP
Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications
2022-06-16 16:40:00
SoC Architecture & Assembly
CAST and Fraunhofer IPMS Mark 20-Year Partnership with Product of the Year Win
2022-06-16 16:40:00
Strategic Partnerships
SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe)
2022-06-16 16:40:00
Misc
QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template
2022-06-16 16:40:00
IP Cores & Design