CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets 2023-05-10 13:06:00 Strategic Partnerships
Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard 2023-05-10 10:56:00 IP Cores & Design
OPENEDGES' 12nm LPDDR5/4x/4 PHY is Ready for Mass Production by Novachips' SSD 2023-05-10 07:58:00 Commercial Deals
Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector 2023-05-10 05:38:00 SoC Architecture & Assembly
FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics 2023-05-09 16:25:00 EDA & Design Tools
Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance 2023-05-08 14:31:00 Financials
BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency 2023-05-08 06:33:00 Misc
LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing 2023-05-08 01:39:00 Misc
NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry 2023-05-04 16:47:00 IP Cores & Design
Via Licensing Alliance Appoints Three New Members to its Board of Directors 2023-05-03 14:22:00 People & Leadership
Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry 2023-05-03 14:07:00 Legal & IP Strategy
UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications 2023-05-03 13:30:00 Foundries & Process Nodes