SCALINX and Arteris Partner on Advanced Communications Innovation 2023-12-12 14:55:00 Commercial Deals
AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions 2023-12-12 14:50:00 Commercial Deals
Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security 2023-12-12 10:34:00 IP Cores & Design
Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development 2023-12-12 08:19:00 SoC Architecture & Assembly
Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance 2023-12-12 08:07:00 Misc
Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges 2023-12-12 08:01:00 Misc
China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce 2023-12-11 14:15:00 Analysis & Insight
EnSilica enters strategic partners with design and custom module developer IndesmaTech 2023-12-11 13:34:00 Strategic Partnerships
NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM 2023-12-11 10:06:00 EDA & Design Tools
12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing 2023-12-11 07:39:00 Misc
Access Advance Announces Major Additions to its HEVC and VVC Patent Pools 2023-12-07 16:46:00 Legal & IP Strategy
Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market 2023-12-07 16:46:00 EDA & Design Tools
CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task 2023-12-07 16:46:00 Misc