Xilinx First To 65nm With Next Generation Virtex FPGAs
2006-02-28 16:52:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 1498 of 1948
PLDA PCI Express IP Chosen by EVE for Zebu Prototyping Platform
2006-02-28 15:37:00
Commercial Deals
Actel Delivers Development Kit for ARM7-Enabled FPGAs
2006-02-28 14:28:00
SoC Architecture & Assembly
Innovative Semiconductor Teams with Denali to Deliver High-Quality USB OTG Solutions
2006-02-28 13:19:00
IP Cores & Design
Celoxica and Philips TASS Team to Accelerate ESL Adoption in Europe
2006-02-28 01:00:00
Misc
Green Hills Software Announces New Development Tools and Operating System for Texas Instruments' DaVinci Technology
2006-02-28 01:00:00
SoC Architecture & Assembly
IPextreme to Accelerate Power Architecture Adoption by Making Valuable Member IP Widely Available
2006-02-27 20:15:00
Misc
Poseidon Design Systems Appoints Brian Bailey as Chief Technologist
2006-02-27 18:34:00
People & Leadership
French startup, Cortus SA, offers compact 32-bit RISC
2006-02-27 17:43:00
IP Cores & Design
Arteris Ships Arteris NoC Solution 1.4 to Accelerate Adoption of Network on Chip
2006-02-27 14:48:00
IP Cores & Design
Impinj Aligns With UMC to Deliver Logic NVM Cores on 0.18um and 0.13um Process Technologies
2006-02-27 12:05:00
IP Cores & Design
ARM Offers Advantage Physical IP Support For IBM, Chartered And Samsung Common Platform On 65-Nanometer Generic Process
2006-02-27 12:00:00
Foundries & Process Nodes
Silicon Design Chain Validates Enhanced Power Management Methodology with ARM 1136JF-S
2006-02-27 11:37:00
EDA & Design Tools
Akustica Launches the World's First Single-Chip Microphone
2006-02-27 09:17:00
IP Cores & Design
Summit Design's Vista IDE Simplifies Intellectual Property Development and Design Sharing For SystemC-Based Designs Without A Run-Time License
2006-02-27 01:00:00
Misc
SystemC finds new horizons
2006-02-27 01:00:00
Misc
Mercury Computer Systems and Texas Instruments Announce a WiMAX AMC for Next-Generation Mobile Broadband Market
2006-02-27 01:00:00
SoC Architecture & Assembly
Vativ Announces Industry's First and Most Advanced Three Input, Dual Output HDMI Receiver Chip for Next Generation Digital TVs
2006-02-27 01:00:00
SoC Architecture & Assembly
Analysis: Chip design outsourcers must embrace IP
2006-02-24 23:59:00
Analysis & Insight
Transmeta Licenses its LongRun2 Technologies for Low Power and Leakage Management to Toshiba
2006-02-24 17:26:00
Commercial Deals