Tensilica Joins Synplicity’s ReadyIP Program and Offers Free Production- Ready Processor Core for FPGAs
2008-04-15 02:03:00
Misc
Semiconductor IP News Archive - Page 1336 of 1971
CoWare Introduces First Ever Checkpoint / Restart Capability for Native SystemC Virtual Platforms
2008-04-14 19:48:00
Misc
Gennum Delivers Low Power, PCI Express 2.0, Infiniband Repeater for System Interconnects
2008-04-14 18:13:00
SoC Architecture & Assembly
Xilinx Unveils Embedded Development Environment and Ecosystem Supporting New Virtex-5 FXT FPGAs
2008-04-14 17:12:00
SoC Architecture & Assembly
QuickLogic and Sital announce development Partnership for MIL-STD-1553 core
2008-04-14 16:55:00
Strategic Partnerships
Global Unichip Announces First Full Service SiP Production Flow in the Fabless ASIC Industry
2008-04-14 16:31:00
SoC Architecture & Assembly
ARM Enhances Feature Set of Popular Cortex-M3 Processor for Extreme Low-Power Functionality
2008-04-14 16:26:00
IP Cores & Design
ARM and Express Logic Enhance Out-of-Box Experience for ThreadX Development with RealView Tools
2008-04-14 16:25:00
SoC Architecture & Assembly
AMCC and Redpine Signals Collaborate on Next Generation Power Architecture-Based Embedded Wi-Fi Connectivity Solutions
2008-04-14 16:25:00
SoC Architecture & Assembly
Energy Micro Licenses Cortex-M3 Processor
2008-04-14 16:21:00
Commercial Deals
MIPS Technologies to Showcase Digital Entertainment, Networking and Microcontroller Innovations at ESC 2008
2008-04-14 16:19:00
Misc
Xilinx Demonstrates New Triple-Rate SDI Reference Designs for Broadcast Video Applications at NAB 2008
2008-04-14 14:59:00
SoC Architecture & Assembly
Xilinx Virtex-5 FPGA Powers New Universal Multi-Channel Processor From Miranda Technologies
2008-04-14 14:03:00
SoC Architecture & Assembly
Xilinx and OmniTek Successfully Deploy Advanced Video Processing Platform
2008-04-14 12:37:00
SoC Architecture & Assembly
Xilinx Virtex-5 FPGA Accelerates Development of Ross Video Multi-Definition Keyer for Digital Broadcast Production Applications
2008-04-14 08:16:00
SoC Architecture & Assembly
Kodak Selects intoPIX Technology for Digital Cinema
2008-04-11 21:29:00
Commercial Deals
STMicroelectronics Achieves Highest Memory Density for ARM9 Standard MCUs, Delivering Pin- and Function Compatibility with Embedded Flash of 288 Kbytes to 2.1 Mbytes
2008-04-11 16:43:00
SoC Architecture & Assembly
Analysis: Is the ST, NXP wireless JV the start of IDM break-up?
2008-04-11 15:55:00
Analysis & Insight
Gaisler Research Announces Nucleus OS Support for The LEON Processor
2008-04-11 11:19:00
SoC Architecture & Assembly
STMicroelectronics and NXP Merge Wireless Businesses to Expand Product Breadth and Boost Innovation
2008-04-11 10:49:00
SoC Architecture & Assembly